South Korea's Lee says Samsung chip packaging expansion to spur $30 billion additional investment

行业与产业 · 人工智能 · sea · 来源：CNA Singapore · 2026-11-12 01:42

关键词：综合

原文链接：https://www.channelnewsasia.com/business/south-koreas-lee-says-samsung-chip-packaging-expansion-spur-30-billion-additional-investment-6544456

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